Marginal Microleakage and Morphological Characteristics of a Solvent-Free One-Step Self-Etch Adhesive (B1SF)

In recent years, newly developed solvent-free dental adhesives have been introduced. The aim of this study was to evaluate the marginal integrity of a new one-step solvent-free self-etch adhesive and to compare it with a commonly used two-step self-etch adhesive as the gold standard.

Class V cavities (2×4×1.5 mm) were prepared on the buccal aspects of 28 human premolars. The cervical margins of the cavity preparations were placed 1 mm apical to the CEJ. Clearfil SE Bond (CSEB) (two-step self-etch adhesive) and Bond 1SF (B1SF) (one-step self-etch adhesive) were applied to the cavities in groups 1 and 2 (n=14), respectively. Then, the specimens were restored with A2 shade of APX composite resin. Each group was evaluated for dye penetration under a stereomicroscope at ×32 after 24 hours and 500 rounds of thermocycling. Statistical analyses were carried out using Mann Whitney test (α=0.05). In addition, in each experimental group, two specimens were prepared for analysis under SEM.

There were no significant differences in enamel margin microleakage between the two adhesives used (P=0.24(; whereas, there were significant differences in dentin margin microleakage between CSEB and B1SF (P=0.004). Dentin microleakage of B1SF was higher than that of CSEB.

Results showed that the enamel marginal integrity of B1SF as a newly developed one-step solvent-free self-etch adhesive was similar to that of CSEB as a commonly used two-step self-etch; however, dentinal sealing of CSEB was better than that of B1SF.