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Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
Published on: May 23, 2017
Micro-strain sensing using wrinkled stiff thin films on soft substrates as tunable optical grating.
Teng Ma1, Hanshuang Liang, George Chen
1School for Engineering of Matter, Transport and Energy, Arizona State University, Tempe, AZ, USA.
Optics Express
|June 6, 2013
Summary
This study introduces a novel strain sensing method using wrinkled poly (dimethylsiloxane) (PDMS) optical gratings. This technique accurately measures material strain and determines the coefficient of thermal expansion (CTE) of substrates like copper and silicon.
Area of Science:
- Materials Science
- Optical Engineering
- Strain Measurement
Background:
- Optical gratings are crucial for various sensing applications.
- Poly (dimethylsiloxane) (PDMS) offers unique properties for fabricating flexible optical components.
- Understanding thermal expansion is vital for material selection and performance prediction.
Purpose of the Study:
- To develop and validate a novel strain sensing approach using wrinkled PDMS as an optical grating.
- To investigate the mechanism of strain sensing based on PDMS grating periodicity changes.
- To determine the coefficient of thermal expansion (CTE) of different materials using this method.
Main Methods:
- Fabrication of wrinkled PDMS patterns to serve as optical gratings.
- Bonding PDMS gratings onto substrates (e.g., copper, silicon).
- Inducing thermal strain and measuring changes in the diffraction angle of the PDMS grating.
Main Results:
- The wrinkled PDMS grating effectively functions as an optical sensor for thermally-induced strain.
- The change in grating periodicity directly correlates with the applied thermal strain.
- Measured CTE values for copper and silicon substrates closely matched established reference values.
Conclusions:
- The proposed PDMS-based optical grating is a viable method for strain sensing.
- This technique enables accurate determination of material CTE through thermal strain analysis.
- The approach offers a promising tool for material characterization and thermal stress evaluation.
