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Related Concept Videos

Mechanisms of Heat Transfer I01:14

Mechanisms of Heat Transfer I

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Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
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Mechanisms of Heat Transfer II01:20

Mechanisms of Heat Transfer II

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In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
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P-N junction01:11

P-N junction

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A p-n junction is formed when p-type and n-type semiconductor materials are joined together. At the interface of the p-n junction, holes from the p-side and electrons from the n-side begin to diffuse into the opposite sides due to the concentration gradient. This diffusion of carriers leads to a region around the junction where there are no free charge carriers, known as the depletion region. The charge density within the depletion region for the n-side and p-side can be described by the...
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Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

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The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
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Biasing of Metal-Semiconductor Junctions01:27

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Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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Mechanisms of Heat Transfer01:14

Mechanisms of Heat Transfer

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Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...
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Characterization of Thermal Transport in One-dimensional Solid Materials
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Heat dissipation in atomic-scale junctions.

Woochul Lee1, Kyeongtae Kim, Wonho Jeong

  • 1Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109, USA.

Nature
|June 15, 2013
PubMed
Summary
This summary is machine-generated.

Researchers investigated heat dissipation in atomic and molecular junctions. They discovered that energy-dependent electronic transmission causes asymmetric heat flow, advancing understanding of nanoscale thermal transport.

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Area of Science:

  • Condensed Matter Physics
  • Nanotechnology
  • Quantum Transport

Background:

  • Atomic and single-molecule junctions push the limits of electrical circuit miniaturization.
  • They serve as platforms for testing quantum transport theories in nanoscale devices.
  • While electric and thermoelectric phenomena are studied, heat dissipation remains challenging to characterize.

Purpose of the Study:

  • To investigate heat dissipation in the electrodes of single-molecule junctions.
  • To understand the relationship between electronic transmission characteristics and heat dissipation.
  • To establish a framework for heat dissipation in mesoscopic systems with elastic transport.

Main Methods:

  • Utilized custom-fabricated scanning probes with integrated nanoscale thermocouples.
  • Investigated heat dissipation in single-molecule ('molecular') and few-atom ('atomic') gold junctions.
  • Analyzed heat dissipation asymmetry based on bias polarity and charge carrier type (electrons vs. holes).

Main Results:

  • Found that energy-dependent transmission characteristics lead to asymmetric heat dissipation in molecular junctions.
  • Observed that this asymmetry depends on bias polarity and charge carriers (electrons/holes).
  • Atomic junctions with weak energy dependence showed no significant asymmetry.

Conclusions:

  • Electronic transmission characteristics directly correlate with heat dissipation properties in atomic-scale junctions.
  • Established a framework for understanding heat dissipation in mesoscopic systems with elastic transport.
  • Paved the way for experimental studies of atomic-scale Peltier effects and heat transport.