Long-term dispersion stability and adhesion promotion of aqueous Cu nano-ink for flexible printed electronics

Aqueous Cu nanoparticles are synthesized using a reducing agent and surface capping molecule which prevents the interparticular agglomeration and surface oxidation. Aqueous conductive nano ink is prepared using the resulting Cu nanoparticles and conductive Cu layers are prepared via a wet coating process. The conductive Cu layers, metalized by annealing at 300 degrees C under vacuum atmosphere, exhibit excellent electrical resistivity, showing values as low as 12 microomega cm. The long-term dispersion stability for three months is monitored through an investigation on the rheological behavior of the conductive nano ink and the resistivity variation of the conductive Cu layer. The adhesion property of the conductive Cu layer is dramatically improved when using a primer-treated polyimide film, whereas the conductive Cu layer completely peels off on a pristine polyimide film. The epoxy-contained primer plays a critical role as an intermediary between the aqueous Cu nano ink and the polyimide film.