A wireless passive pressure microsensor fabricated in HTCC MEMS technology for harsh environments

Area of Science:

• Materials Science
• Sensor Technology
• Wireless Communication

Background:

• Harsh environments require robust sensors capable of high-temperature operation.
• Existing wireless sensors may have limitations in extreme conditions or require complex sealing.
• High-temperature co-fired ceramics (HTCC) offer excellent thermal stability and chemical resistance.

Purpose of the Study:

• To propose and demonstrate a wireless passive high-temperature pressure sensor.
• To fabricate the sensor using HTCC technology for harsh environment applications.
• To evaluate the sensor's performance, including wireless data acquisition and operational characteristics.

Main Methods:

• Fabrication of a wireless passive pressure sensor using HTCC technology.
• Development of a wireless data acquisition system utilizing mutual inductance coupling.
• Experimental characterization of the sensor's frequency-pressure, frequency-temperature, and coupling distance performance.

Main Results:

• The HTCC sensor demonstrated wireless operability at 600 °C.
• A maximum wireless coupling distance of 2.8 cm was achieved at room temperature.
• The sensor exhibited a sensitivity of approximately 860 Hz/bar with low hysteresis and repeatability errors.

Conclusions:

• The developed wireless passive HTCC pressure sensor is suitable for high-temperature and harsh environments.
• The sensor's gastight design and wireless capabilities enable reliable operation without an evacuation channel.
• The sensor shows promising performance metrics for industrial and scientific applications requiring high-temperature pressure monitoring.