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Optimized Fabrication Procedure for High-Quality Graphene-based Moiré Superlattice Devices
Published on: July 11, 2025
Graphene interconnects fully encapsulated in layered insulator hexagonal boron nitride
Nikhil Jain1, Chris A Durcan, Robin Jacobs-Gedrim
1College of Nanoscale Science and Engineering, State University of New York, Albany, NY 12203, USA.
Nanotechnology
|August 7, 2013
Summary
Full encapsulation of graphene interconnects using hexagonal boron nitride (h-BN) significantly enhances electrical performance. This breakthrough improves current density, breakdown voltage, and power density without compromising carrier transport or environmental stability.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Graphene interconnects are promising for advanced electronics.
- Their electrical performance is often limited by environmental factors and surface effects.
- Encapsulation strategies are crucial for realizing graphene's full potential.
Purpose of the Study:
- To improve the electrical performance of graphene interconnects.
- To investigate the effect of full encapsulation with hexagonal boron nitride (h-BN).
- To develop a novel method for fabricating h-BN/graphene/h-BN heterostructures.
Main Methods:
- Development of a layer-based transfer method for h-BN encapsulation.
- Fabrication of h-BN/graphene/h-BN heterostructures.
- Electrical characterization and comparison of encapsulated graphene interconnects (EGIs) with control samples.
Main Results:
- EGIs exhibited significantly improved maximum current density and breakdown voltage.
- A ~67% increase in power density at breakdown was observed in EGIs.
- Electrical performance remained stable and insensitive to ambient conditions.
Conclusions:
- Full encapsulation with lattice-matching h-BN effectively enhances graphene interconnect performance.
- The developed fabrication method is suitable for creating robust, high-performance graphene devices.
- EGIs offer a promising solution for stable and efficient electronic interconnects.
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