LC Circuits
Electronic Distance Measuring Instruments
Electro-mechanical Systems
Spindle Assembly
Spindle Assembly
Coplanar Forces
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Updated: May 8, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Chyan-Chyi Wu1, Yan-Zou Chen, Chia-Huang Liao
1Department of Mechanical and Electro-mechanical Engineering, Tamkang University, Taiwan. chyanchyi@gmail.com
A novel common-path laser planar encoder (CLPE) achieves high-resolution 2D displacement measurements. This technology minimizes environmental disturbances for precise nanometer-level accuracy in X- and Y- axes.
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