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Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
T B Britton1, J Jiang, R Clough
1Department of Materials, University of Oxford, Parks Road, Oxford OX1 3PH, United Kingdom.
High-resolution electron backscatter diffraction (EBSD) mapped residual strain and lattice rotation in silicon after microhardness indentation. Finite element analysis validated experimental results, showing good agreement in residual strain and crack size.
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