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Shape memory polymer nanocomposites for application of multiple-field active disassembly: experiment and simulation
John Carrell1, Hong-Chao Zhang, Shiren Wang
1Department of Industrial Engineering, and ‡Department of Mechanical Engineering, Texas Tech University , Lubbock, Texas 79409, United States.
Active disassembly (AD) using shape memory polymer (SMP) nanocomposites offers improved end-of-life processing. A novel multi-field actuation method enhances fastener performance and reduces accidental disassembly risks.
Area of Science:
- Materials Science
- Engineering
- Polymer Science
Background:
- Active disassembly (AD) utilizes smart materials for controlled product deconstruction.
- Current AD methods face challenges with single-field actuation, leading to accidental disassembly.
- Improved disassembly enhances component reuse and recycling stream purity.
Purpose of the Study:
- To investigate the application of shape memory polymer (SMP) nanocomposites in a novel AD process.
- To develop and analyze an AD process utilizing multi-field actuation for SMP nanocomposite fasteners.
- To address the limitations of single-field actuation in AD systems.
Main Methods:
- Development of SMP nanocomposites for AD applications.
- Implementation of a multi-field actuation strategy (thermal and magnetic).
- Finite-element analysis (FEA) to model and simulate the AD process.
Main Results:
- Experimental testing of SMP nanocomposites under thermal and magnetic fields.
- FEA simulations provided performance variables for the multi-field AD process.
- The SMP nanocomposite fastener demonstrated superior performance time compared to conventional SMP fasteners.
Conclusions:
- Multi-field actuation of SMP nanocomposites presents a viable solution for controlled active disassembly.
- The novel AD process mitigates risks associated with accidental disassembly.
- SMP nanocomposites show significant potential for advancing sustainable end-of-life product management.
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