Shape memory polymer nanocomposites for application of multiple-field active disassembly: experiment and simulation

John Carrell1, Hong-Chao Zhang, Shiren Wang

  • 1Department of Industrial Engineering, and ‡Department of Mechanical Engineering, Texas Tech University , Lubbock, Texas 79409, United States.

Summary

Active disassembly (AD) using shape memory polymer (SMP) nanocomposites offers improved end-of-life processing. A novel multi-field actuation method enhances fastener performance and reduces accidental disassembly risks.

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