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Quantitative annular dark field electron microscopy using single electron signals.

Ryo Ishikawa1, Andrew R Lupini1, Scott D Findlay2

  • 1Oak Ridge National Laboratory, Materials Science and Technology Division, Oak Ridge, TN 37831, USA.

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|October 31, 2013
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Summary
This summary is machine-generated.

Accurately measuring sample thickness in electron microscopy is challenging. This new method uses detector signal levels to precisely count atoms column-by-column in annular dark field images, improving materials analysis.

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Area of Science:

  • Materials Science
  • Physics
  • Chemistry

Background:

  • Analyzing atomic resolution electron microscope images is often hindered by unknown or imprecisely fitted sample thickness.
  • Accurate, parameter-free, column-by-column thickness quantification with single-atom precision is highly desirable for applications like simulation matching.

Purpose of the Study:

  • To propose a novel, parameter-free method for quantifying sample thickness in annular dark field scanning transmission electron microscopy (ADF STEM).
  • To enable accurate atom counting at the atomic scale by leveraging detector signal levels.

Main Methods:

  • Utilized the single electron intensity level of the detector in ADF STEM.
  • Employed mean intensity averaged over a primitive cell for atom counting, eliminating the need for fitting parameters.
  • Applied the method to quantify Al (or N) atoms in aluminum nitride single crystals.

Main Results:

  • Demonstrated a routine quantification method for ADF STEM images across various beam currents and dynamic range conditions.
  • Successfully counted the number of Al (or N) atoms per primitive cell in aluminum nitride, ranging from 3 to 99 atoms.
  • Showcased the method's utility for analyzing ultra-thin or light-element materials.

Conclusions:

  • The proposed method offers a parameter-free, single-atom accurate thickness quantification for ADF STEM.
  • This technique facilitates precise atom counting, crucial for advanced materials characterization and simulation validation.
  • The method is versatile, applicable to diverse materials and imaging conditions.