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Updated: May 5, 2026

Nanomoulding of Functional Materials, a Versatile Complementary Pattern Replication Method to Nanoimprinting
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Nanoscale platinum printing on insulating substrates.

C D O'Connell1, M J Higgins, R P Sullivan

  • 1ARC Centre of Excellence for Electromaterials Science, Intelligent Polymer Research Institute, Innovation Campus, University of Wollongong, NSW 2522, Australia.

Nanotechnology
|November 26, 2013
PubMed
Summary

A novel method enables platinum electrode deposition on flexible materials using low-temperature nitrogen plasma and dip-pen nanolithography (DPN). This technique allows for nanoscale platinum features on diverse substrates, crucial for flexible electronics and bionic implants.

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrochemistry

Background:

  • Noble metal deposition is critical for flexible electronics and soft bionic implants.
  • Existing methods often require high temperatures, limiting substrate compatibility.

Purpose of the Study:

  • To develop a versatile, low-temperature method for depositing platinum electrodes on various substrates.
  • To enable nanoscale feature fabrication for advanced electronic and biomedical applications.

Main Methods:

  • Utilized a novel low-temperature nitrogen plasma reduction of chloroplatinic acid.
  • Developed a printable chloroplatinic acid ink with ethylene glycol for dip-pen nanolithography (DPN).
  • Applied the method to substrates including Si, glass, ITO, Ge, PDMS, and Parylene C.

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Main Results:

  • Achieved routine fabrication of 60 nm platinum features on silicon.
  • Confirmed platinum reduction using EDS and XRD.
  • Demonstrated high electrochemical activity of printed platinum features via SECM.

Conclusions:

  • The developed strategy offers a versatile, low-temperature approach for nanoscale platinum deposition.
  • This technique is suitable for a wide range of materials, including flexible polymers and insulators.
  • The method holds significant potential for fabricating components in flexible electronics and soft bionic implants.