An occupational exposure assessment for engineered nanoparticles used in semiconductor fabrication

Engineered nanoparticles of alumina, amorphous silica, and ceria are used in semiconductor device fabrication during wafer polishing steps referred to as 'chemical mechanical planarization' (CMP). Some metal oxide nanoparticles can impact the biological response of cells and organ systems and may cause adverse health effects; additional research is necessary to better understand potential risks from nanomaterial applications and occupational exposure scenarios. This study was conducted to assess potential airborne exposures to nanoparticles and agglomerates using direct-reading instruments and filter-based samples to characterize workplace aerosols by particle number, mass, size, composition, and morphology. Sampling was repeated for tasks in three work areas (fab, subfab, wastewater treatment) at a facility using engineered nanoparticles for CMP. Real-time measurements were collected using a condensation particle counter (CPC), optical particle counter, and scanning mobility particle spectrometer (SMPS). Filter-based samples were analyzed for total mass or the respirable fraction, and for specific metals of interest. Additional air sample filters were analyzed by transmission electron microscopy with energy dispersive x-ray spectroscopy (TEM/EDX) for elemental identification and to provide data on particle size, morphology, and concentration. Peak concentrations measured on the CPC ranged from 1 to 16 particles per cubic centimeter (P cm(-3)) for background and from 4 to 74 P cm(-3) during tasks sampled in the fab; from 1 to 60 P cm(-3) for background and from 3 to 84 P cm(-3) for tasks sampled in the subfab; and from 1160 to 45 894 P cm(-3) for background and from 1710 to 45 519 P cm(-3) during wastewater treatment system filter change tasks. Significant variability was seen among the repeated task measurements and among background comparisons in each area. Several data analysis methods were used to compare each set of task and background measurements. Increased concentrations of respirable particles were identified for some tasks sampled in each work area, although of relatively low magnitude and inconsistently among repeated measurements for specific tasks. Measurements with a portable SMPS indicated that nanoparticle number concentrations (channels 11.5-115.5nm) increased above background levels by 3.2 P cm(-3) during CMP tool set-up in the fab area but were not elevated when changing filters for the CMP wastewater treatment system. All results from mass concentration analysis were below the limits of detection. Characterization by TEM/EDX identified structures containing the elements of interest (Al, Si), primarily as agglomerates or aggregates in the 100-1000nm size range. Although health-based occupational exposure limits have not been established for nanoscale alumina, silica, or ceria, the measured concentrations by number and mass were below currently proposed benchmarks or reference values for poorly soluble low-toxicity nanoparticles.