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Micromachining techniques in developing high-frequency piezoelectric composite ultrasonic array transducers.

Changgeng Liu, Frank T Djuth, Qifa Zhou

    IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
    |December 4, 2013
    PubMed
    Summary
    This summary is machine-generated.

    This study presents advanced micromachining methods for creating high-frequency ultrasonic array transducers. The developed techniques enable the fabrication of dense, high-performance piezoelectric composite transducers for advanced imaging applications.

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    Area of Science:

    • Materials Science and Engineering
    • Acoustics and Ultrasonics
    • Nanotechnology and Microfabrication

    Background:

    • High-frequency ultrasonic array transducers are crucial for advanced medical imaging and non-destructive testing.
    • Existing fabrication methods face challenges in achieving high element density and miniaturization for improved resolution.
    • Piezoelectric composite materials offer enhanced performance but require sophisticated manufacturing processes.

    Purpose of the Study:

    • To detail novel micromachining techniques for fabricating high-frequency piezoelectric composite ultrasonic array transducers.
    • To demonstrate the feasibility of a hybrid array transducer design with integrated 2-D and annular arrays.
    • To establish a process flow for creating high-density, small-element arrays for improved ultrasonic imaging.

    Main Methods:

    • Utilized deep reactive ion etching (DRIE) for patterning piezoelectric (1-x)Pb(Mg1/3Nb2/3)O3-xPbTiO3 (PMN-PT)/epoxy 1-3 composite pillars.
    • Developed techniques for attaching backing material and assembling electronic interconnections for array elements.
    • Fabricated and assessed a hybrid test array transducer with 8x8 2-D and 5-element annular arrays operating at ~60 MHz.

    Main Results:

    • Achieved a center frequency of approximately 60 MHz with a -6-dB bandwidth of around 50%.
    • Demonstrated low crosstalk (-33 dB) between adjacent 2-D array elements.
    • Successfully fabricated small elements (105x105 μm for 2-D array) with fine kerfs (5 μm).

    Conclusions:

    • The described micromachining techniques are effective for fabricating high-frequency ultrasonic array transducers.
    • The developed process flow enables the creation of larger arrays with smaller elements for enhanced ultrasonic applications.
    • The novel interconnection strategy supports high-density, miniaturized array element assembly.