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Fabrication of copper patterns on flexible substrate by patterning-adsorption-plating process.

Yu Chang1, Chao Yang, Xin-Yao Zheng

  • 1Department of Materials Science, Fudan University , Shanghai, P.R. China.

ACS Applied Materials & Interfaces
|January 7, 2014
PubMed
Summary

A new inkjet printing method creates reliable, conductive copper patterns on plastic. This additive fabrication process uses functional ink and electroless plating for strong adhesion and excellent conductivity.

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Area of Science:

  • Materials Science
  • Additive Manufacturing
  • Surface Chemistry

Background:

  • Additive fabrication of conductive patterns on flexible substrates is challenging.
  • Existing methods often lack reliability and good adhesion.
  • Need for advanced techniques for patterning functional materials.

Purpose of the Study:

  • To develop a novel patterning-adsorption-plating process for additive fabrication of copper patterns.
  • To enhance the reliability and adhesion of copper patterns on PET substrates.
  • To achieve high conductivity in additively manufactured copper patterns.

Main Methods:

  • Inkjet printing of functional ink containing ion-adsorption nanoparticles onto PET substrate.
  • Adsorption of catalytic ions onto the patterned film via amino groups.
  • Electroless plating of copper catalyzed by adsorbed ions.
  • Introduction of mercapto groups for enhanced pattern reliability.
  • Use of specific solvents to increase surface roughness for improved adhesion.

Main Results:

  • Successfully fabricated copper patterns using the novel process.
  • Achieved excellent electrical conductivity comparable to bulk copper.
  • Demonstrated good adhesion of copper patterns on PET substrate.
  • Mercapto groups improved pattern reliability.
  • Increased surface roughness enhanced pattern adhesion.

Conclusions:

  • The developed patterning-adsorption-plating process is effective for additive fabrication of high-quality copper patterns.
  • The process offers a viable method for creating conductive patterns on flexible plastic substrates.
  • The resulting copper patterns exhibit excellent conductivity and adhesion, suitable for various applications.