Behaviors of printed circuit boards due to microwave supported curing process of coating materials

The Application of a microwave supported curing process for coatings in the field of electronic industry poses a challenge. Here the implementation of this technology is represented. Within the scope of the investigation special PCB Test Layouts were designed and the polymer curing process examined by the method of dielectric analysis. Furthermore the coupling of microwave radiation with conductive PCB structures was analyzed experimentally by means of special test boards. The formation of standing waves and regular heating distribution along the conductive wires on the PCB could be observed. The experimental results were compared with numerical simulation. In this context the numerical analysis of microwave PCB interaction led to important findings concerning wave propagation on wired PCB. The final valuation demonstrated a substantial similarity between numerical simulations and experimental results.