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Quality factor effect on the wireless range of microstrip patch antenna strain sensors
Ali Daliri1, Amir Galehdar2, Wayne S T Rowe3
1School of Electrical and Computer Engineering, RMIT University, GPO Box 2476, Melbourne, Victoria 3001, Australia. ali.daliri@rmit.edu.au.
Researchers enhanced wireless strain sensors using circular microstrip patch antenna (CMPA) design. Optimizing substrate materials extended the wireless reading range four-fold, improving sensor viability for structural health monitoring.
Area of Science:
- Electrical Engineering
- Materials Science
- Structural Health Monitoring
Background:
- Passive wireless strain sensors utilizing microstrip patch antennas offer potential for structural health and usage monitoring.
- Current limitations include a restricted wireless interrogation range (typically a few centimeters).
Purpose of the Study:
- To investigate the impact of circular microstrip patch antenna (CMPA) design on sensor quality factor and wireless reading range.
- To enhance the practical application of wireless strain sensors by extending their interrogation distance.
Main Methods:
- Design and simulation of Circular Microstrip Patch Antennas (CMPAs).
- Evaluation of different substrate materials for antenna performance.
- Measurement of wireless interrogation range and quality factor.
Main Results:
- Optimized CMPA design using specific substrate materials significantly improved the quality factor.
- The wireless interrogation distance was extended four-fold, from 5 cm to 20 cm.
- Demonstrated a substantial increase in the practical wireless reading range.
Conclusions:
- Appropriate substrate material selection is crucial for enhancing CMPA sensor performance.
- The improved interrogation range significantly boosts the viability of wireless sensors for strain measurement and damage detection in aerospace and civil applications.
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