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Methods of Ex Situ and In Situ Investigations of Structural Transformations: The Case of Crystallization of Metallic Glasses
Published on: June 7, 2018
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Correlation between atomic structure evolution and strength in a bulk metallic glass at cryogenic temperature.
1Laboratory for Microstructures, Shanghai University, 200444 Shanghai, China.
Scientific Reports
|January 29, 2014
Summary
This study reveals how bulk metallic glass (BMG) atomic structures change at cryogenic temperatures. Lower temperatures increase activation energy for atomic shifts, enhancing BMG strength.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Amorphous Materials
Background:
- Bulk metallic glasses (BMGs) exhibit unique mechanical properties.
- Understanding atomic-scale structural evolution is crucial for BMG applications.
- Cryogenic temperatures significantly influence material behavior.
Purpose of the Study:
- To investigate the atomic-scale structural evolution of a Zr-Ti-Ni-Cu-Be BMG at cryogenic temperatures.
- To establish the relationship between structural changes and BMG strength.
- To identify the key factors governing BMG strength at low temperatures.
Main Methods:
- High energy X-ray synchrotron radiation was used to probe atomic structure.
- A model Zr41.25Ti13.75Ni10Cu12.5Be22.5 (at.%) bulk metallic glass was studied.
- Experiments were conducted with decreasing temperature down to cryogenic levels.
Main Results:
- A strong correlation was observed between atomic structure evolution and BMG strength.
- An increase in activation energy for atomic shifting at lower temperatures was identified as the primary strength-influencing factor.
- The study provides insights into atomic-scale structural changes under cryogenic conditions.
Conclusions:
- The findings offer a fundamental understanding of atomic-scale structure evolution in BMGs.
- The results bridge the gap between atomic-scale physics and macro-scale fracture strength.
- This research contributes to the design and application of BMGs at low temperatures.
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