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One-step fabrication of a highly conductive and durable copper paste and its flexible dipole tag-antenna application
Keun-Young Shin1, James S Lee, Jin-Yong Hong
1World Class University (WCU) Program of Chemical Convergence for Energy & Environment (C2E2), School of Chemical and Biological Engineering, College of Engineering, Seoul National University (SNU), Seoul, Korea. jsjang@plaza.snu.ac.kr.
Chemical Communications (Cambridge, England)
|February 12, 2014
Abstract:
A highly conductive and durable copper (Cu) paste was successfully fabricated via acid treatment and mechanical blending with corrosion inhibitors. A screen-printed Cu pattern was evaluated as a dipole tag-antenna with long term and thermal stability, and structural flexibility.
