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40 Gb/s optical subassembly module for a multi-channel bidirectional optical link.

Jamshid Sangirov, Gwan-Chong Joo, Jae-Shik Choi

    Optics Express
    |February 12, 2014
    PubMed
    Summary
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    This study demonstrates a 40 Gb/s bidirectional optical link using silicon-based optical subassembly (OSA) modules. The design achieves low crosstalk, enabling efficient full-duplex communication for high-speed data transmission.

    Area of Science:

    • Photonics and Optical Engineering
    • Silicon Photonics
    • Optical Communication Systems

    Background:

    • High-speed optical communication links are crucial for modern data networks.
    • Reducing optical crosstalk and improving integration are key challenges in optical subassembly (OSA) module design.
    • Silicon photonics offers potential for miniaturization and cost-effective fabrication of optical components.

    Purpose of the Study:

    • To demonstrate a 40 Gb/s bidirectional optical link utilizing silicon-based optical subassembly (OSA) modules.
    • To investigate the effectiveness of using widely separated wavelengths (850 nm and 1060 nm) for reducing optical crosstalk.
    • To showcase the integration of various optical components onto silicon optical benches (SiOBs) for enhanced functionality.

    Main Methods:

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    • Fabrication of a bidirectional OSA module using V-grooved silicon substrates and silicon optical benches (SiOBs).
    • Integration of photodiodes (PDs), vertical-cavity surface-emitting lasers (VCSELs), and monitoring PDs on SiOBs.
    • Implementation of wavelength separation using a 45° mirror within the fiber for distinct up- and down-link signals.

    Main Results:

    • The bidirectional OSA module achieved a Bit Error Rate (BER) below 10⁻¹² at 10 Gb/s per channel.
    • Negligible crosstalk was observed in the full-duplex operation mode.
    • Measured inter-channel crosstalk for the 40 Gb/s link was approximately -22.6 dB.

    Conclusions:

    • The demonstrated silicon-based bidirectional OSA module offers a viable solution for high-speed optical links.
    • The use of separated wavelengths and integrated silicon components effectively minimizes optical crosstalk.
    • This technology paves the way for more compact and efficient optical communication systems.