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Updated: May 3, 2026

Fabrication and Characterization of Thickness Mode Piezoelectric Devices for Atomization and Acoustofluidics
Published on: August 5, 2020
G Goavec-Mérou1, N Chrétien2, J-M Friedt2
1FEMTO-ST, Time and Frequency Department, UMR CNRS 6174, Univ. Franche Comté, Besançon, France.
This study showcases contactless vibration analysis for moving equipment using Field Programmable Gate Arrays (FPGAs). High-speed measurements enable advanced displacement detection and wireless strain gauging, demonstrating efficient real-time signal processing.
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