Chemical mechanical polishing to improve the efficiency uniformity of beam sampling grating

In order to improve the efficiency uniformity of large-aperture beam sampling gratings (BSGs), a conventional chemical mechanical polishing (CMP) process of fused silica by CeO₂ slurry is proposed to modify their groove profiles. With the proposed CMP process, the efficiency uniformity of several BSGs with an aperture of 430  mm×430  mm has been successfully controlled within an rms of 5%. The proposed CMP process is an effective method to improve the efficiency uniformity of large-aperture BSGs. Using the proposed CMP process, the requirement of the uniformity of the holographic ion beam etching process can be released in the realization of large-aperture BSGs.