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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Packaging commercial CMOS chips for lab on a chip integration.

Timir Datta-Chaudhuri¹, Pamela Abshire, Elisabeth Smela

¹Department of Electrical and Computer Engineering, 2160 A.V. Williams, College Park, Maryland, USA.

|April 1, 2014

Summary

A novel, simple packaging method integrates microelectronic complementary metal oxide semiconductor (CMOS) circuits into lab-on-a-chip (LOC) devices. This technique enables advanced miniaturized sensing systems with biocompatible and reusable packaging.

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A Microfluidic Chip for ICPMS Sample Introduction

A Microfluidic Chip for ICPMS Sample Introduction

Published on: March 5, 2015

Area of Science:

Microfluidics and Integrated Circuitry
Biocompatible Packaging for Lab-on-a-Chip Devices
Miniaturized Sensing Systems

Background:

Lab-on-a-chip (LOC) devices integrate sensing capabilities, reducing reliance on benchtop equipment.
Integrating microelectronics, specifically complementary metal oxide semiconductor (CMOS) circuits, onto small LOCs presents significant packaging challenges.
Existing packaging methods often struggle with small chip sizes and achieving a level surface for subsequent processing.

Purpose of the Study:

To present a simple and adaptable packaging method for embedding foundry-fabricated CMOS dies into LOC devices.
To demonstrate the compatibility and functionality of the packaged CMOS sensors for biological applications.
To validate the biocompatibility, robustness, and reusability of the developed packaging solution.

Main Methods:

Embedding mm-sized CMOS dies into an epoxy handle wafer to create a level, large-area surface.
Utilizing thin film metal traces passivated with parylene-C for off-chip electrical connections.
Patterning parylene to expose active sensing areas for direct fluidic interaction.

Main Results:

Successful packaging of CMOS bioamplifier and capacitance sensor chips, enabling extracellular signal recording and cell monitoring.
Demonstrated biocompatibility through long-term cell culture (weeks) on packaged chips.
Confirmed package robustness and reusability through extended fluid exposure (months) and repeated sterilization.

Conclusions:

The developed packaging method is simple, accommodates various die sizes, and ensures surface leveling for microfluidic integration.
The packaging is biocompatible, robust, and reusable, making it suitable for long-term biological sensing applications.
This approach facilitates the adoption of miniaturized sensing systems, driving innovation in LOC technology.