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Robust source and mask optimization compensating for mask topography effects in computational lithography.

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    This study introduces a novel source mask optimization (SMO) method that incorporates pupil wavefront aberrations to improve usable depth of focus (uDOF) and pattern fidelity in advanced optical lithography. The approach effectively compensates for mask topography effects, enhancing process yield.

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    Area of Science:

    • Optical Lithography
    • Computational Lithography
    • Semiconductor Manufacturing

    Background:

    • Advanced optical lithography requires accurate source mask optimization (SMO) to address mask topography effects.
    • Conventional SMO methods struggle with mask-induced phase errors that reduce usable depth of focus (uDOF) and process yield.
    • Rigorous 3D mask models are computationally intensive.

    Purpose of the Study:

    • To develop an alternative SMO approach that maximizes uDOF by incorporating pupil wavefront aberrations.
    • To compensate for mask topography effects in optical lithography.
    • To enhance pattern fidelity and process yield.

    Main Methods:

    • Designed pupil wavefront function using Zernike polynomials for primary and secondary spherical aberrations.
    • Applied conjugate gradient method for optimal source-mask pair under aberrated pupil conditions.
    • Utilized a statistical model for Zernike coefficient determination for phase control.

    Main Results:

    • The proposed approach effectively compensates for mask topography effects.
    • Improved pattern fidelity was observed in rigorous simulations of thick masks.
    • Significant increase in usable depth of focus (uDOF) was achieved.

    Conclusions:

    • Incorporating pupil wavefront aberrations into SMO is a viable strategy to mitigate mask topography effects.
    • The developed method enhances both pattern fidelity and uDOF, leading to improved lithographic performance.
    • This technique offers a computationally efficient alternative for advanced optical lithography challenges.