Updated: Apr 29, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Hyeon-Ho Jeong1, Andrew G Mark, John G Gibbs
1Max Planck Institute for Intelligent Systems, Heisenbergstr. 3, D-70569 Stuttgart, Germany.
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Researchers developed a new method for fabricating isolated 3D nanostructures using electron-beam lithography seeds and glancing angle deposition. This technique allows for precise control over nanoscale object shapes and arrangements for advanced nanodevices.
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