Related Experiment Video
Updated: Apr 28, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
The development of a portable ultrahigh vacuum chamber via silicon block
Ho-Chiao Chuang1, Chia-Shiuan Huang1
1Department of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, Taiwan.
Abstract:
This paper describes a nonmetallic, light weight portable chamber for ultra-high vacuum (UHV) applications. The chamber consists of a processed silicon block anodically bonding five polished Pyrex glass windows and a Pyrex glass adapter, without using any screws, bolts or vacuum adhesives. The design features provide an alternative chamber for UHV applications which require nonmetallic components. We have cyclically baked the chamber up to 180 °C for 160 h and have achieved an ultimate pressure of 1.4 × 10(-9) Torr (limited by our pumping station), with no leak detected. Both Pyrex glass windows and Pyrex glass adapter have been used successfully.

