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Minimizing thermal stress for data center servers through thermal-aware relocation
Muhammad Tayyab Chaudhry1, T C Ling1, S A Hussain2
1Universiti Malaya, 50603 Kuala Lumpur, Wilayah Persekutuan, Malaysia.
Abstract:
A rise in inlet air temperature may lower the rate of heat dissipation from air cooled computing servers. This introduces a thermal stress to these servers. As a result, the poorly cooled active servers will start conducting heat to the neighboring servers and giving rise to hotspot regions of thermal stress, inside the data center. As a result, the physical hardware of these servers may fail, thus causing performance loss, monetary loss, and higher energy consumption for cooling mechanism. In order to minimize these situations, this paper performs the profiling of inlet temperature sensitivity (ITS) and defines the optimum location for each server to minimize the chances of creating a thermal hotspot and thermal stress. Based upon novel ITS analysis, a thermal state monitoring and server relocation algorithm for data centers is being proposed. The contribution of this paper is bringing the peak outlet temperatures of the relocated servers closer to average outlet temperature by over 5 times, lowering the average peak outlet temperature by 3.5% and minimizing the thermal stress.
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