Decomposition of poly(amide-imide) film enameled on solid copper wire using atmospheric pressure non-equilibrium
Kazuo Sugiyama1, Katsunori Suzuki2, Shusuke Kuwasima2
1Department of Chemical and Biological Engineering, Hachinohe National College of Technology, Tamonoki, Hachinohe City, 039-1192 Aomori, Japan. sugiyama-c@hachinohe-ct.ac.jp
Abstract:
The decomposition of a poly(amide-imide) thin film coated on a solid copper wire was attempted using atmospheric pressure non-equilibrium plasma. The plasma was produced by applying microwave power to an electrically conductive material in a gas mixture of argon, oxygen, and hydrogen. The poly(amide-imide) thin film was easily decomposed by argon-oxygen mixed gas plasma and an oxidized copper surface was obtained. The reduction of the oxidized surface with argon-hydrogen mixed gas plasma rapidly yielded a metallic copper surface. A continuous plasma heat-treatment process using a combination of both the argon-oxygen plasma and argon-hydrogen plasma was found to be suitable for the decomposition of the poly(amide-imide) thin film coated on the solid copper wire.
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