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Influence of metal co-deposition on silicon nanodot patterning dynamics during ion-beam sputtering
R Gago1, A Redondo-Cubero, F J Palomares
1Instituto de Ciencia de Materiales de Madrid, Consejo Superior de Investigaciones Científicas, E-28049 Madrid, Spain.
Nanotechnology
|September 25, 2014
Summary
Metal co-deposition during ion-beam sputtering (IBS) significantly influences silicon nanodot formation. Controlling metal type and flux allows tuning pattern properties for ordered array production.
Area of Science:
- Materials Science
- Surface Science
- Nanotechnology
Background:
- Ion-beam sputtering (IBS) is used for surface patterning.
- Understanding nanostructure formation dynamics is crucial for materials engineering.
Purpose of the Study:
- Investigate the impact of metal co-deposition (Fe, Mo) on Si(100) nanodot patterning dynamics during IBS.
- Analyze the influence of metal nature and flux on surface morphology and composition.
Main Methods:
- Normal-incidence 1 keV Ar(+) ion-beam sputtering (IBS).
- Atomic Force Microscopy (AFM) for morphological analysis.
- Rutherford Backscattering Spectrometry (RBS) for compositional analysis.
- X-ray Photoelectron Spectroscopy (XPS) for chemical bonding.
- Current-sensing AFM for electrical properties.
Main Results:
- Higher co-deposition flux accelerates patterning dynamics, increasing roughness and pattern wavelength.
- Molybdenum (Mo) co-deposition results in rougher surfaces at lower coverage than Iron (Fe), yielding more ordered patterns.
- Silicide bond formation occurs early, indicating metal-silicon affinity plays a key role.
- Nanostructures are metal-rich, showing coupled compositional and morphological patterns.
Conclusions:
- Nanodot pattern formation is complex, driven by phase segregation, local flux variations, and silicide formation.
- IBS with metal co-deposition offers a tunable method for controlling nanostructure dynamics and properties.
- Highly ordered nanodot arrays can be produced by optimizing process parameters.
