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High-speed Particle Image Velocimetry Near Surfaces
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Fast convolution method and its application in mask optimization for intensity calculation using basis expansion.

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    A new convolution using basis expansion (CBE) method speeds up inverse lithography techniques. This approach reduces computational cost for mask pattern analysis while maintaining image quality, benefiting semiconductor manufacturing.

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    Area of Science:

    • Computational lithography
    • Semiconductor manufacturing technology
    • Image processing algorithms

    Background:

    • Accurate mask pattern representation in inverse lithography requires finer grids, leading to large data sizes and high computational demands.
    • Intensive convolutions during mask optimization pose significant computational challenges.

    Purpose of the Study:

    • To introduce a novel method, convolution using basis expansion (CBE), to mitigate computational costs in mask optimization for inverse lithography.
    • To enable efficient mask pattern analysis and simulation without sacrificing accuracy.

    Main Methods:

    • Projection of fine grid matrices onto a coarse grid using a base matrix set.
    • Performing convolutions on the coarse grid using expansion coefficients.
    • Approximating fine grid convolution via interpolation and a sum of coarse grid convolutions.

    Main Results:

    • The CBE method was validated through random matrix convolutions and lithography simulation intensity calculations.
    • Demonstrated similar image quality compared to traditional convolution methods.
    • Achieved significant running speed enhancements.

    Conclusions:

    • Convolution using basis expansion (CBE) effectively reduces computational load in inverse lithography.
    • The method offers a practical solution for accelerating mask optimization and lithography simulations.
    • CBE presents a viable approach for enhancing efficiency in semiconductor mask design.