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Silicon photonics packaging with lateral fiber coupling to apodized grating coupler embedded circuit
Optics Express
|October 17, 2014
Summary
A new laser welding method for silicon photonics packaging offers relaxed alignment tolerances and achieved 1.2 dB excess loss. This lateral fiber coupling technique provides a cost-effective solution for telecommunication systems.
Area of Science:
- Photonics and Optical Engineering
- Materials Science and Engineering
Background:
- Silicon photonics circuits require robust and efficient packaging for integration into telecommunication systems.
- Traditional fiber optic packaging methods often face challenges with alignment precision and cost.
Purpose of the Study:
- To introduce a novel lateral packaging approach for silicon photonics using laser welding and angle-polished fiber coupling.
- To demonstrate relaxed alignment tolerances and low excess loss in the developed packaging process.
Main Methods:
- Utilized laser welding for a novel lateral packaging technique.
- Employed angle-polished fiber for coupling to grating couplers embedded in silicon photonic circuits.
Main Results:
- Achieved a packaging excess loss of 1.2 dB.
- Demonstrated relaxed alignment tolerances during the fiber packaging process.
Conclusions:
- The developed lateral packaging approach using laser welding and angle-polished fiber is a viable alternative for silicon photonics.
- This method offers a cost-effective solution for deploying silicon photonics packaging in telecommunication applications.
