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Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization
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A three-dimensional microdisplacement sensing system based on MEMS bulk-silicon technology.

Junjie Wu1, Lihua Lei2, Xin Chen3

  • 1School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, No. 800, Dongchuan Road, Shanghai 200240, China. wujunjiesimt@gmail.com.

Sensors (Basel, Switzerland)
|November 1, 2014
PubMed
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This summary is machine-generated.

A novel three-dimensional microdisplacement sensing system utilizes silicon

Area of Science:

  • Materials Science and Engineering
  • Nanotechnology
  • Sensors and Transducers

Background:

  • Accurate dimensional measurement of micro/nano-components is crucial for advanced manufacturing.
  • Existing methods may lack precision or three-dimensional capabilities.
  • The piezoresistive effect in silicon offers potential for high-resolution sensing.

Purpose of the Study:

  • To develop and validate a 3D microdisplacement sensing system for micro/nano-component characterization.
  • To achieve high sensitivity and resolution in both axial and lateral directions.
  • To demonstrate the system's capability for precise dimensional metrology.

Main Methods:

  • Fabrication of a silicon-based sensor using microelectromechanical system (MEMS) bulk-silicon technology.

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  • Validation of the sensor design using finite element method (FEM) simulations.
  • Development of a high-precision data acquisition circuit (20 μV accuracy) for weak signal detection.

    • Main Results:

    • The sensing system demonstrated sensitivities of 17.29 mV/μm (axial) and 4.59 mV/μm (lateral).
    • Nonlinearity was measured at 0.8% (axial) and 1.0% (lateral) full scale.
    • Achieved a full range of 4.6 μm (axial) with resolutions of 5 nm (axial) and 10 nm (lateral).

    Conclusions:

    • The developed 3D microdisplacement sensing system effectively measures and characterizes micro/nano-components.
    • The system exhibits high sensitivity, low nonlinearity, and excellent resolution.
    • This technology is suitable for precision metrology in micro/nanoscale applications.