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Studying localized corrosion using liquid cell transmission electron microscopy.

See Wee Chee1, Sarah H Pratt, Khalid Hattar

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Localized corrosion of copper and aluminum thin films in salt water was observed using advanced electron microscopy. Potentiostatic control initiated pitting, and ion implantation altered aluminum

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Area of Science:

  • Materials Science
  • Electrochemistry
  • Corrosion Science

Background:

  • Localized corrosion of thin films is a critical failure mechanism in electronic devices.
  • Understanding the initiation and progression of corrosion is essential for material durability.

Purpose of the Study:

  • To investigate the localized corrosion behavior of copper (Cu) and aluminum (Al) thin films.
  • To explore methods for initiating and modifying corrosion susceptibility in these films.

Main Methods:

  • Liquid cell transmission electron microscopy (LCTEM) was employed for in-situ observation.
  • Potentiostatic control was utilized to drive corrosion processes.
  • Focused ion beam (FIB) implantation of gold (Au+) ions was performed to induce local compositional changes.

Main Results:

  • LCTEM successfully visualized the localized corrosion, specifically pitting, of Cu and Al thin films in aqueous sodium chloride (NaCl) solutions.
  • Potentiostatic control effectively initiated pitting corrosion.
  • Focused ion beam implantation of Au+ ions demonstrably altered the corrosion susceptibility of Al films.

Conclusions:

  • In-situ LCTEM is a powerful technique for studying dynamic corrosion processes at the nanoscale.
  • Corrosion initiation in thin films can be controlled electrochemically.
  • Local compositional modifications can significantly influence the corrosion resistance of materials like aluminum.