High thermal conductivity in amorphous polymer blends by engineered interchain interactions
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Updated: Apr 20, 2026

Designing Silk-silk Protein Alloy Materials for Biomedical Applications
Published on: August 13, 2014
Gun-Ho Kim1, Dongwook Lee2, Apoorv Shanker2
11] Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109-2125, USA [2] Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109-2136, USA.
Abstract:
Thermal conductivity is an important property for polymers, as it often affects product reliability (for example, electronics packaging), functionality (for example, thermal interface materials) and/or manufacturing cost. However, polymer thermal conductivities primarily fall within a relatively narrow range (0.1-0.5 W m(-1) K(-1)) and are largely unexplored. Here, we show that a blend of two polymers with high miscibility and appropriately chosen linker structure can yield a dense and homogeneously distributed thermal network. A sharp increase in cross-plane thermal conductivity is observed under these conditions, reaching over 1.5 W m(-1) K(-1) in typical spin-cast polymer blend films of nanoscale thickness, which is approximately an order of magnitude larger than that of other amorphous polymers.
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