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We created a modular platform for controlling solid-state qubits at cryogenic temperatures. This design simplifies qubit system development by separating components, reducing costs for multiple prototypes.

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Area of Science:

  • Quantum computing hardware
  • Cryogenic engineering
  • Solid-state physics

Background:

  • Scalable control and readout of solid-state qubits are crucial for advancing quantum computing.
  • Existing interconnect solutions can be complex and costly to replicate for each new qubit prototype.
  • Efficient signal transmission and minimal crosstalk are essential for high-fidelity qubit operations.

Purpose of the Study:

  • To develop and characterize a modular interconnect platform for controlling and reading out multiple solid-state qubits at cryogenic temperatures.
  • To enable cost-effective scaling of quantum computing hardware by simplifying the duplication of interconnect circuits.
  • To assess the performance of the platform, including signal integrity and crosstalk, at milli-Kelvin temperatures.

Main Methods:

  • Designed a modular interconnect platform featuring 74 filtered dc-bias connections, 32 control/readout connections (>-3 dB at 5 GHz), and 4 low-loss microwave feed lines (<-3 dB at 10 GHz).
  • Incorporated a radio-frequency interposer to create a two-printed circuit board (PCB) design, separating the qubit-bonded board from the main board with complex components.
  • Tested the platform's performance at milli-Kelvin temperatures, performing signal transmission and crosstalk measurements.

Main Results:

  • The platform successfully provides a high density of filtered DC bias and high-frequency control/readout connections.
  • The modular design, enabled by the RF interposer, effectively decouples the qubit chip interface from the main interconnect board.
  • Initial performance data at milli-Kelvin temperatures demonstrates acceptable signal transmission and crosstalk levels for qubit control.

Conclusions:

  • The developed modular interconnect platform offers a scalable and cost-effective solution for solid-state qubit control and readout at cryogenic temperatures.
  • The two-PCB design simplifies the development and reduces the cost associated with fabricating multiple quantum computing prototypes.
  • This platform is a promising advancement for building larger and more complex solid-state quantum processors.