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Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy.

Aftab M Hussain1, Ernesto Byas Lizardo, Galo A Torres Sevilla

  • 1Integrated Nanotechnology Laboratory, Computer Electrical Mathematical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia.

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Researchers developed an 800% stretchable copper thermal patch. This reusable, affordable device offers wireless thermal control for various applications.

Keywords:
copperflexibilitypain managementstretchabilitythermal patches

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Thermal Engineering

Background:

  • Metallic thin films are typically rigid and limited in stretchability.
  • Developing flexible and adaptable thermal management solutions is crucial for advanced electronics and wearables.

Purpose of the Study:

  • To create a highly stretchable, non-polymeric thermal patch using copper.
  • To achieve wireless controllability and adaptability in a mobile thermal management system.

Main Methods:

  • Utilized a novel fabrication process for metallic thin-film copper (Cu).
  • Integrated complementary metal-oxide-semiconductor (CMOS) compatible technology for seamless integration.
  • Designed for spatial tunability and adaptive heat output based on localized temperature.

Main Results:

  • Achieved an unprecedented 800% stretchability in the copper-based thermal patch.
  • Demonstrated wireless controllability and adaptive thermal regulation.
  • Confirmed reusability and affordability due to low-cost manufacturing.

Conclusions:

  • The developed copper thermal patch offers a breakthrough in flexible and non-invasive thermal management.
  • Its unique properties enable versatile applications requiring adaptable, wirelessly controlled heating or cooling.
  • The low-cost, CMOS-compatible integration ensures broad applicability and commercial viability.