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Updated: Apr 19, 2026

Growth and Electrostatic/chemical Properties of Metal/LaAlO3/SrTiO3 Heterostructures
Published on: February 8, 2018
1Department of Materials Engineering, The University of Tokyo , Tokyo, Japan.
Copper (Cu) migration and ionization at the Cu/Ta2O5 interface are key to forming conductive filaments in resistance switches. Amorphous Ta2O5 facilitates Cu ionization and filament formation more than crystalline Ta2O5.
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