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System-in-package solution for a low-power active electrode module.

Nikolas Gaio, Linping Gao, Jinhe Cai

    Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference
    |January 9, 2015
    PubMed
    Summary
    This summary is machine-generated.

    This study introduces a novel low-power active electrode module using System-in-Package (SiP) technology for cost-effective, high-density electrocardiogram (ECG) systems. The developed SiP offers reusability and simplified integration, reducing time-to-market for medical devices.

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    Area of Science:

    • Biomedical Engineering
    • Materials Science and Engineering
    • Electrical Engineering

    Background:

    • Traditional active electrode modules can be costly and complex to integrate.
    • System-in-Package (SiP) technology offers potential for miniaturization and cost reduction in electronic modules.
    • Modular active electrodes are crucial for portable and high-density electrocardiogram (ECG) systems.

    Purpose of the Study:

    • To design and develop a low-power, cost-effective, high-density, and high-quality modular active electrode using SiP technology.
    • To explore the novel application of SiP technology in the development of modular active electrodes.
    • To create a reusable and easily integrable active electrode module for various ECG systems.

    Main Methods:

    • Design of two distinct System-in-Package (SiP) solutions for a low-power active electrode module.
    • Fabrication and testing of one SiP module with dimensions of 7x7x1 mm, designed for hand soldering.
    • Design of a second, smaller SiP module (4.5x4.5x1 mm) optimized for advanced manufacturing technologies.
    • Characterization of the active electrode's performance, including bandwidth (7.9 mHz to 300 Hz) and mid-band gain (up to 40 dB).

    Main Results:

    • Successful design and fabrication of a compact SiP module for active electrodes.
    • Demonstrated ease of integration using Ball Grid Array (BGA) and Land Grid Array (LGA) interconnections.
    • Achieved a wide operational bandwidth and adjustable gain suitable for ECG applications.
    • Validated the functionality of the fabricated SiP on a printed circuit board (PCB) using a biomedical signal simulator.

    Conclusions:

    • System-in-Package (SiP) technology presents a viable and innovative approach for developing advanced modular active electrodes.
    • The designed SiP modules offer significant advantages in terms of cost, density, quality, and ease of integration for ECG systems.
    • This work represents the first known application of SiP technology for modular active electrodes, paving the way for future advancements in wearable and implantable medical devices.