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Updated: Apr 17, 2026

Theoretical Calculation and Experimental Verification for Dislocation Reduction in Germanium Epitaxial Layers with Semicylindrical Voids on Silicon
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Hyperdoping silicon with selenium: solid vs. liquid phase epitaxy.

Shengqiang Zhou1, Fang Liu2, S Prucnal1

  • 1Helmholtz-Zentrum Dresden-Rossendorf, Institute of Ion Beam Physics and Materials Research, Bautzner Landstr. 400, 01328 Dresden, Germany.

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Summary
This summary is machine-generated.

Flash-lamp annealing of selenium-implanted silicon offers a scalable method for creating hyperdoped materials. This technique prevents surface segregation, achieving higher carrier mobility and lower resistivity compared to laser annealing methods.

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Area of Science:

  • Materials Science
  • Semiconductor Physics
  • Nanotechnology

Background:

  • Chalcogen-hyperdoped silicon is crucial for infrared photodetectors and solar cells.
  • Previous fabrication methods like laser annealing face challenges with surface segregation due to low chalcogen solubility in silicon.

Purpose of the Study:

  • To introduce and evaluate flash-lamp annealing as a novel solid-phase processing technique for chalcogen-hyperdoped silicon.
  • To compare flash-lamp annealing with traditional laser annealing methods.

Main Methods:

  • Selenium ions were implanted into silicon wafers.
  • Flash-lamp annealing was performed in the millisecond timescale.
  • Characterization of substitutional fraction, concentration, resistivity, and carrier mobility was conducted.

Main Results:

  • Flash-lamp annealed selenium-implanted silicon achieved a substitutional fraction of ~70% at concentrations up to 2.3%.
  • Achieved lower resistivity and higher carrier mobility compared to nanosecond pulsed laser annealed samples.
  • Demonstrated superior performance in preventing surface segregation.

Conclusions:

  • Flash-lamp annealing is an effective and scalable method for producing high-quality chalcogen-hyperdoped silicon.
  • This technique overcomes the limitations of laser annealing, particularly surface segregation.
  • The developed method shows significant promise for advanced silicon-based electronic and optoelectronic devices.