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Preparation of Samples for Electron Microscopy01:20

Preparation of Samples for Electron Microscopy

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To be visualized by an electron microscope, either transmission or scanning, biological samples need to be fixed (stabilized) so the electron beam does not destroy them and dried thoroughly (desiccated/dehydrated) so the vacuum does not affect them. Fixation needs to be done as quickly as possible because the sample properties will start changing as soon as it is removed from its natural environment. For example, in a tissue sample, the oxygen levels begin decreasing, causing an altered...
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Embedded purification for electron beam induced Pt deposition using MeCpPtMe3.

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    Two room-temperature electron beam induced deposition methods for high purity platinum (Pt) were explored. A parallel, single-step process yielded void-free platinum with significantly lower resistivity compared to a sequential method.

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    Area of Science:

    • Materials Science
    • Nanotechnology
    • Surface Science

    Background:

    • Electron beam induced deposition (EBID) is a versatile nanofabrication technique.
    • Achieving high purity platinum (Pt) deposits with low resistivity remains a challenge.
    • Optimizing precursor and purification methods is crucial for advanced applications.

    Purpose of the Study:

    • To investigate two distinct room-temperature processes for high purity Pt deposition via EBID.
    • To compare the effectiveness of sequential versus parallel deposition methods.
    • To evaluate the purity, structure, and electrical properties of the resulting Pt films.

    Main Methods:

    • Investigated a sequential EBID process: standard Pt deposition followed by e-beam post-irradiation with oxygen.
    • Developed and tested a parallel, single-step EBID process with simultaneous precursor and oxygen flow.
    • Utilized an add-on device for the parallel process integrated with a gas injector system (GIS).

    Main Results:

    • Both methods achieved high purity Pt depositions (close to 100 at%).
    • The sequential method produced Pt with small voids, ~100 nm thickness, and resistivity of 88 ± 10 μΩ cm.
    • The parallel method yielded void-free Pt with resistivity of 60 ± 5 μΩ cm, six times the bulk value.

    Conclusions:

    • Both sequential and parallel EBID processes can produce high purity platinum.
    • The parallel, single-step method is simpler and produces superior void-free Pt with significantly lower resistivity.
    • The parallel method offers an improved approach for fabricating high-quality platinum nanostructures.