A methodology for high resolution digital image correlation in high temperature experiments
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Published on: April 16, 2017
Justin Blaber1, Benjamin S Adair1, Antonia Antoniou1
1The Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, Georgia 30332, USA.
Abstract:
We propose a methodology for performing high resolution Digital Image Correlation (DIC) analysis during high-temperature mechanical tests. Specifically, we describe a technique for producing a stable, high-quality pattern on metal surfaces along with a simple optical system that uses a visible-range camera and a long-range microscope. The results are analyzed with a high-quality open-source DIC software developed by us. Using the proposed technique, we successfully acquired high-resolution strain maps of the crack tip field in a nickel superalloy sample at 1000 °C.

