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Modulation behaviors of surface plasmon coupled light-emitting diode
Optics Express
|April 4, 2015
Summary
Surface plasmon (SP) coupling significantly enhances light-emitting diode (LED) modulation bandwidth by 44-48%. This improvement is consistent across various LED sizes and current densities, despite increased RC time constants.
Area of Science:
- Optoelectronics
- Materials Science
- Semiconductor Devices
Background:
- Light-emitting diodes (LEDs) are crucial optoelectronic devices.
- Modulation bandwidth determines the speed of LED operation.
- Surface plasmon (SP) coupling is a technique to enhance light-matter interactions.
Purpose of the Study:
- To compare modulation bandwidths of LEDs with and without SP coupling.
- To investigate the effect of SP coupling on LED performance across different mesa sizes and current densities.
- To analyze the factors limiting the modulation bandwidth enhancement by SP coupling.
Main Methods:
- Fabrication of LEDs with varying square-mesa sizes (60-300 micron).
- Integration of Ag nanoparticles and GaZnO dielectric interlayer for SP coupling.
- Measurement of modulation bandwidths and photoluminescence decay rates.
- Analysis of RC time constants (resistance and capacitance).
Main Results:
- SP coupling enhanced modulation bandwidth by 44-48% for LEDs.
- Enhancement was independent of LED mesa size and injected current density (139-1667 A/cm²).
- Observed enhancement ratios were lower than predicted by photoluminescence decay rates due to increased RC time constants.
Conclusions:
- SP coupling is an effective method to boost LED modulation bandwidth.
- Increased device resistance, due to SP coupling materials, limits the full potential enhancement.
- Further optimization of SP coupling integration is needed to overcome RC limitations.

