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High-resolution Thermal Micro-imaging Using Europium Chelate Luminescent Coatings

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Published on: April 16, 2017

Methods for topography artifacts compensation in scanning thermal microscopy.

Jan Martinek¹, Petr Klapetek², Anna Charvátová Campbell³

¹Czech Metrology Institute, Okružní 31, 638 00 Brno, Czech Republic; Department of Physics, Faculty of Civil Engineering, BUT, Žižkova 17, Brno 602 00, Czech Republic.

Ultramicroscopy

|May 6, 2015

Summary

Scanning thermal microscopy (SThM) artifacts from sample topography can obscure thermal conductivity measurements. This study compares three methods to numerically estimate and compensate for these topography-induced artifacts, improving SThM accuracy.

Keywords:

Artifacts Neural networks Scanning thermal microscopy

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Area of Science:

Materials Science
Nanotechnology
Surface Science

Background:

Scanning thermal microscopy (SThM) provides valuable thermal conductivity contrast images.
Local sample topography often introduces significant artifacts in SThM measurements, obscuring true thermal conductivity variations.
These topography artifacts are particularly problematic for samples with sharp features or when using larger probes like Wollaston wire probes.

Purpose of the Study:

To numerically estimate and compensate for topographic artifacts in SThM.
To compare the effectiveness of three distinct methods for artifact correction.
To assess the accuracy and computational cost of each method.

Main Methods:

A simple geometric approach based on local sample geometry near the probe apex.
A neural network analysis trained on probe-sample interaction data.
3D finite element modeling (FEM) to simulate the probe-sample thermal interaction.
All methods utilize local topography and estimated probe shape as input.

Main Results:

Generated maps of false conductivity contrast signals solely due to topography.
Demonstrated the utility of these maps for artifact removal and uncertainty estimation.
Evaluated the accuracy and computational demands of the three artifact compensation techniques.

Conclusions:

Numerical methods can effectively estimate and compensate for topography artifacts in SThM.
The choice of method impacts accuracy and computational resources required.
Accurate topographic artifact correction is crucial for reliable SThM thermal conductivity measurements.