Low Temperature Sintering Cu6 Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit
Ying Zhong1,2, Rong An1,3, Chunqing Wang1,3
1State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.
Abstract:
Brittle intermetallics such as Cu6 Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200 °C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.
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