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Effect of chip spacing on light extraction for light-emitting diode array.

Shuang-Chao Chung, Pei-Chen Ho, Dun-Ru Li

    Optics Express
    |June 16, 2015
    PubMed
    Summary

    Optimizing Gallium Nitride (GaN) LED array packaging requires careful chip spacing to maximize light output. Silicon encapsulation reduces the shielding effect, enhancing light extraction and photon recycling between neighboring chips.

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    Area of Science:

    • Optoelectronics
    • Materials Science
    • Photonics

    Background:

    • High optical flux is crucial for Gallium Nitride (GaN) Light Emitting Diode (LED) arrays.
    • Packaging size reduction necessitates optimizing the spacing between individual LED chips.

    Purpose of the Study:

    • To investigate the impact of chip spacing on light extraction efficiency in GaN LED array packaging.
    • To analyze the shielding effect in GaN LED arrays with and without silicon encapsulation.

    Main Methods:

    • Utilized the Monte Carlo ray-tracing method for optical behavior simulation.
    • Simulated two major types of GaN LED array packaging: bare chip and silicon-encapsulated.

    Main Results:

    • The shielding effect is more pronounced in bare chip GaN LED packaging.

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  • Silicon encapsulation significantly reduces the shielding effect due to enhanced light extraction.
  • Neighboring chips play a critical role in photon recycling within the array.

    • Conclusions:

    • Optimized chip spacing and silicon encapsulation are key for improving light extraction in GaN LED arrays.
    • Photon recycling is an important consideration in the design of densely packed GaN LED arrays.