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20 mJ, 1 ps Yb:YAG Thin-disk Regenerative Amplifier
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8.5 W VECSEL output at 1270 nm with conversion efficiency of 59%.

S T Keller, A Sirbu, V Iakovlev

    Optics Express
    |July 21, 2015
    PubMed
    Summary

    High-efficiency 1270 nm vertical-external-cavity surface-emitting lasers (VECSELs) achieved 59% conversion efficiency and 8.5 W output power. Wafer-fused gain mirrors and flip-chip cooling enabled these powerful laser results.

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    Area of Science:

    • Optics and Photonics
    • Semiconductor Lasers
    • Materials Science

    Background:

    • Vertical-external-cavity surface-emitting lasers (VECSELs) are crucial for various optical applications.
    • Efficient heat dissipation is a key challenge for high-power VECSEL operation.
    • Wafer fusion and flip-chip techniques offer advanced thermal management solutions.

    Purpose of the Study:

    • To develop and characterize high-performance 1270 nm VECSELs.
    • To investigate the impact of thermal effects on VECSEL performance.
    • To optimize VECSEL design for high output power and conversion efficiency.

    Main Methods:

    • Fabrication of VECSELs using wafer-fused gain mirrors.
    • Implementation of a flip-chip (thin-disk) heat dissipation scheme.
    • Experimental measurement of conversion efficiency and output power at varying temperatures and pump powers.

    Main Results:

    • Achieved up to 59% conversion efficiency.
    • Demonstrated maximum output power of 8.5 W (pump limited) at a 5°C heat sink temperature.
    • Observed significant temperature and pump power dependence of reflected pump light from the gain mirror surface.

    Conclusions:

    • The developed VECSELs exhibit high efficiency and output power.
    • The flip-chip, wafer-fused design effectively manages heat for improved laser performance.
    • Understanding pump light reflection is critical for optimizing VECSEL operation under varying conditions.