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Polymer Photovoltaic Cells with Rhenium Oxide as Anode Interlayer
Jinyu Wei1, Dongdong Bai1, Liying Yang2
1School of Management, Tianjin University of Technology, Tianjin, China.
Plos One
|July 31, 2015
Summary
Rhenium oxide (ReO3) insertion as a buffer layer in polymer solar cells decreased performance. Decomposition of ReO3 during thermal evaporation created a higher energy barrier, reducing device efficiency.
Area of Science:
- Materials Science
- Renewable Energy
- Organic Electronics
Background:
- Polymer solar cells (PSCs) offer a promising renewable energy source.
- Regioregular poly(3-hexylthiophene) (P3HT) and methanofullerene [6,6]-phenyl C61-butyric acid methyl ester (PCBM) are common active layer materials.
- Interfacial layers are crucial for optimizing charge transport and device performance in PSCs.
Purpose of the Study:
- To investigate the effect of rhenium oxide (ReO3) as a buffer layer on the performance of P3HT:PCBM based polymer solar cells.
- To understand the influence of ReO3 layer thickness on the electrical characteristics of these solar cells.
- To explore the mechanism behind the observed decrease in device performance.
Main Methods:
- Fabrication of polymer solar cells using P3HT:PCBM active layers and ReO3 buffer layers.
- Characterization of electrical properties, including open-circuit voltage (Voc).
- X-ray photoelectron spectroscopy (XPS) to analyze ReO3 oxidation states.
- Kelvin Probe measurements to determine the work function of the ReO3 layer.
Main Results:
- Insertion of a ReO3 interfacial layer led to decreased performance in P3HT:PCBM solar cells.
- XPS analysis indicated ReO3 decomposition during thermal evaporation.
- Kelvin Probe measurements revealed a work function of 5.13 eV for evaporated ReO3.
- The decomposition resulted in a lower work function buffer layer, creating a higher energy barrier between ITO and the active layer.
Conclusions:
- Rhenium oxide is not a suitable buffer layer material for P3HT:PCBM polymer solar cells due to performance degradation.
- ReO3 decomposition during thermal evaporation is the primary cause of reduced device efficiency.
- The formation of a higher energy barrier at the ITO/active layer interface impedes charge extraction.

