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Updated: Apr 4, 2026

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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
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Self-assembled large scale metal alloy grid patterns as flexible transparent conductive layers
Melinda Mohl1, Aron Dombovari1, Robert Vajtai2
1Microelectronics and Materials Physics Laboratories, Department of Electrical Engineering, University of Oulu, P.O. Box 4500, Oulu FIN-90014, Finland.
Scientific Reports
|September 4, 2015
Summary
Researchers developed scalable, low-cost transparent conductive films (TCFs) using inkjet printing and copper plating as alternatives to indium tin oxide (ITO). These films offer excellent conductivity and flexibility for optoelectronic applications.
Area of Science:
- Materials Science
- Nanotechnology
- Optoelectronics
Background:
- Indium tin oxide (ITO) is the standard for transparent conductive films (TCFs) but faces cost and resource limitations.
- Developing scalable and cost-effective alternatives to ITO is crucial for advancing optoelectronics.
Purpose of the Study:
- To pioneer scalable synthesis of TCFs as viable ITO replacements.
- To investigate palladium-copper (PdCu) and silver-copper (AgCu) nanostructures for transparent conductive applications.
Main Methods:
- Utilized reactive inkjet printing and coffee-ring effect deposition.
- Employed subsequent chemical copper plating for film formation.
- Fabricated PdCu grid and AgCu fish-scale patterns on flexible PET substrates.
Main Results:
- Achieved low sheet resistance: 8.1 Ω/sq for PdCu and 4.9 Ω/sq for AgCu.
- Obtained optical transmittance of 79% (PdCu) and 65% (AgCu) at 500 nm.
- Demonstrated excellent adhesion and conductivity retention (<4% decrease after 10^5 bending cycles).
Conclusions:
- PdCu and AgCu films are promising, scalable alternatives to ITO for optoelectronic devices.
- The developed TCFs exhibit high performance, durability, and flexibility.
- Applications include capacitive touch screens and micro-electrode arrays.

