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C-Depth Method to Determine Diffusion Coefficient and Partition Coefficient of PCB in Building Materials.
Cong Liu1, Barbara Kolarik2, Lars Gunnarsen2
1Department of Building Science, Tsinghua University , Beijing 100084, China.
A new C-depth method quantifies polychlorinated biphenyls (PCBs) partitioning in buildings. This approach accurately determines diffusion (D) and partition (K) coefficients, crucial for assessing PCB exposure and guiding remediation efforts.
Area of Science:
- Environmental Science
- Chemical Engineering
- Building Science
Background:
- Polychlorinated biphenyls (PCBs) are persistent environmental pollutants found in many buildings.
- High PCB concentrations in buildings necessitate effective exposure assessment and remediation strategies.
- Understanding PCB partitioning between sources and building materials is critical for managing contamination.
Purpose of the Study:
- To develop and validate a novel C-depth method for determining PCB diffusion (D) and partition (K) coefficients.
- To assess the performance of the C-depth method compared to existing techniques.
- To identify key factors influencing PCB partitioning in building materials.
Main Methods:
- Development of the C-depth method to calculate diffusion (D) and partition (K) coefficients.
- Application of the method to concrete as a primary building material.
- Comparison of C-depth method results with existing methods and a two-term approach.
- Sensitivity analysis to identify critical parameters for D and K determination.
Main Results:
- The C-depth method provides unique estimations for D and K without requiring assumed correlations.
- Relative standard deviations for K were 5%-22% and for D were 42%-66% across five datasets for concrete.
- Comparison with a two-term approach indicated significant uncertainty for D and smaller uncertainty for K.
- Model predictions showed good agreement with measurements, supporting engineering application.
Conclusions:
- The C-depth method offers a robust approach for determining PCB partitioning parameters (D and K).
- Effective diffusion distance, contact time, and measurement depth are critical for D.
- PCB concentration in primary sources is a critical factor for K.
- Results are acceptable for engineering applications despite inherent uncertainties.
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