Experimental Investigation of Thermal Performance of Miniature Heat Pipe Using SiO2-Water Nanofluids

The four miniature heat pipes filled with DI water and SiO2-water nanofluids containing different volume concentrations (0.2%, 0.6% and 1.0%) are experimentally measured on the condition of air and water cooling. The wall temperature and the thermal resistance are investigated for three inclination angles. At the same of inlet heat water temperature in the heat system, it is observed that the total wall temperatures on the evaporator section are almost retaining constant by air cooling and the wall temperatures at the front end of the evaporator section are slightly reduced by water cooling. However, the wall temperatures at the condenser section using SiO2-water nanofluids are all higher than that for DI water on the two cooling conditions. As compared with the heat pipe using DI water, the decreasing of the thermal resistance in heat pipe using nanofluids is about 43.10%-74.46% by air cooling and 51.43%-72.22% by water cooling. These indicate that the utilization of SiO2-water nanofluids as working fluids enhances the performance of the miniature heat pipe. When the four miniature heat pipes are cut to examine at the end of the experiment, a thin coating on the surface of the screen mesh of the heat pipe using SiO2-water nanofluids is found. This may be one reason for reinforcing the heat transfer performance of the miniature heat pipe.