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Monolithic III-V on Silicon Plasmonic Nanolaser Structure for Optical Interconnects
Ning Li1, Ke Liu2,3, Volker J Sorger2
1IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, New York 10598, USA.
Scientific Reports
|September 16, 2015
Summary
We developed novel plasmonic III-V nanolasers for direct integration onto silicon chips. These nanolasers offer enhanced performance, reduced power consumption, and robust fabrication for optical interconnects.
Area of Science:
- Materials Science
- Optoelectronics
- Nanotechnology
Background:
- Monolithic integration of III-V semiconductor lasers with silicon (Si) circuits is crucial for advancing optical interconnects.
- Current integration methods face challenges with cost, performance, and defect management.
Purpose of the Study:
- To investigate plasmonic III-V nanolasers as a superior monolithic light source for silicon chips.
- To leverage unique advantages of submicron footprint for defect-free growth and CMOS co-integration.
Main Methods:
- Direct epitaxial growth of III-V materials on silicon substrates using submicron cavity footprints.
- Fabrication of nano-cavity optoelectronic devices compatible with complementary metal-oxide-semiconductor (CMOS) processes.
- Analysis of device performance, including power consumption and modulation bandwidth, considering fabrication variations.
Main Results:
- Achieved defect-free heteroepitaxial growth of III-V materials on Si due to small nanolaser footprint.
- Demonstrated significant reduction in power consumption (orders of magnitude lower) compared to conventional lasers.
- Showcased enhanced modulation bandwidth due to increased photon state density and transition rates.
- Confirmed robustness of device performance against surface recombination and fabrication variations.
Conclusions:
- Plasmonic III-V nanolasers represent a viable and advantageous solution for monolithic light sources on silicon.
- The proposed approach overcomes key challenges in III-V on Si integration, enabling high-performance, low-power optical interconnects.
- The technology is robust and compatible with existing CMOS fabrication, paving the way for widespread adoption.

